The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints

By G. Zeng, Stuart D. McDonald, Q. Gu, Y. Terada, K. Uesugi, H. Yasuda, Kazuhiro Nogita. 2015

152 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/ed49cbd9fc6498afd5bc02ddeb2bc328300985f5