Strained Si, SiGe, and Ge on-insulator: review of wafer bonding fabrication techniques

By G. Taraschi, A. Pitera, E. Fitzgerald. 2004

134 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/ed1d6620a2e4413c85e8949042b9f4973aa919c7

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In Electrical and Electronic Engineering

1. Steven J. Koester

Citations in the corpus

• Germanium-on-SOI Infrared Detectors for Integrated Photonic Applications (2006, methodology): “Though some promise for creating “pure” Ge-on-insulator exists, either through wafer bonding [52] or novel epitaxial techniques [53], using the current”