Thermally conducting aluminum nitride polymer-matrix composites
By Yunsheng Xu, D. Chung, C. Mroz. 2001
509 citations recorded by the source corpus.
Subfields: Biomedical Engineering, Ceramics and Composites, Materials Chemistry
View Paper: https://www.semanticscholar.org/paper/eb26e12783799968a07bbdcf7c0e0a0f259981b6
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In Biomedical Engineering
In Ceramics and Composites
In Materials Chemistry
Citations in the corpus
- The Classical Nature of Thermal Conduction in Nanofluids (2008, methodology): “The experimental data [30, 88-93] are represented by the symbols.”
- Effect of Particle Shape on Thermal Conductivity of Copper Reinforced Polymer Composites (2007, background): “, in electronic packaging in applications with decreasing geometric dimensions and increasing output of power, like in computer chips or in electronic packaging [4,5].”
- Polymer composites for thermal management: a review (2016, background): “achieved with 60% volume of AlN-based poly vinylidene fluoride and epoxy-based composites respectively.[47] Low oxidation resistance and the relatively high dielectric properties are the limiting factors of AlN for applications.”
- A review of dielectric polymer composites with high thermal conductivity (2011, background): “0 W·m·K have been reported for 60 vol% AlN-based polyvinylidene fluoride and epoxy composites, respectively [8].”