Microstructure evolution in Sn–Bi and Sn–Bi–Cu solder joints under thermal aging

By Hui-Wei Miao, J. Duh. 2001

153 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/ea43573e1235f3cbf28f54e53936f216dbe8ea12