Influence of additives on Cu electrodeposition mechanisms in acid solution: direct current study supported by non-electrochemical measurements

By L. Bonou, M. Eyraud, R. Denoyel, Y. Massiani. 2002

158 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electrochemistry, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/e6f0607e84b89f0966b0c4427a4239ec96c7f3a2