Electrospun nanofiber reinforced and toughened composites through in situ nano-interface formation

By Song Lin, Q. Cai, Jianying Ji, G. Sui, Yunhua Yu, Xiaoping Yang, Qi Ma, Yan Wei, Xuliang Deng. 2008

140 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Materials Chemistry, Orthodontics

View Paper: https://www.semanticscholar.org/paper/e660e787d9c7170061d209c1781c8e846b68f130

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In Biomedical Engineering

1. David Hui

In Materials Chemistry

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Citations in the corpus

• Nanofibre bridging as a toughening mechanism in carbon/epoxy composite laminates interleaved with electrospun polyamide nanofibrous veils (2015, background): “Several researchers focused on using electrospun nanofibres which dissolve in the matrix resin such as PCL, PEK-C, PSF or phenoxy-based nanofibres [5–10].”
• Mechanical properties of nanomaterials: A review (2020, background): “[55] made nanofibers and matrix interpenetrate and entangle each other through photopolymerization technology, forming an in situ nano-interface that has a strong interface bond between nanofibers and matrix (Figure 10).”