Low-pressure, high-temperature thermal bonding of polymeric microfluidic devices and their applications for electrophoretic separation

By Yi Sun, Y. Kwok, Nam-Trung Nguyen. 2006

166 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/e3ab79d5349aa2df8d58b6efd2184c0f456c68c6

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Biomedical Engineering

1. Chia-Wen Tsao
2. Don L. DeVoe
3. M. Imboden
4. P. Mohanty

In Electrical and Electronic Engineering

1. Chia-Wen Tsao
2. Don L. DeVoe
3. M. Imboden
4. P. Mohanty

Citations in the corpus

• A low temperature surface modification assisted method for bonding plastic substrates (2008, methodology): “Several methods of bonding plastics used in microfluidic devices have been explored and presented in the literature: for example, thermal bonding [5], lamination [6], adhesives”
• Bonding of thermoplastic polymer microfluidics (2009, methodology): “The first approach relies on the use of high bond temperatures as high as 58 C above the substrate Tg, while applying low pressures to limit substrate deformation (Sun et al. 2006; Tan et al. 2008).”