Buckling and cracking of thin films on compliant substrates under compression

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The effects of shear on delamination in layered materials (2004, unknown): “However, as shown by Cotterell and Chen (2000), and Yu and Hutchinson (2002), this assumption of a clamped boundary (no root rotation) may cause significant errors in calculating the crack-tip moment and force if the substrate is compliant.”
Influence of substrate compliance on buckling delamination of thin films (2002, unknown): “The present analysis confirms the work of Cotterell and Chen (2000) who were the first to call attention to the importance of substrate deformation in this phenomenon.”
The fracture of brittle thin films on compliant substrates in flexible displays (2002, methodology): “Based on the new analysis [ 10 ], the delamination toughness is estimated to be about 35 J/m2.”
Concomitant wrinkling and buckle-delamination of elastic thin films on compliant substrates (2011, unknown): “Recent studies (Cotterell and Chen, 2000; Yu and Hutchinson, 2002; Parry et al., 2005) have shown that the critical strain for buckling can be significantly lower than that predicted by (20) when elastic deformation of the substrate is taken into account, especially for relatively compliant substrat”