Investigation of the thermal decomposition of printed circuit boards (PCBs) via thermogravimetric analysis (TGA) and analytical pyrolysis (Py–GC/MS)

By P. Evangelopoulos, E. Kantarelis, Weihong Yang. 2015

137 citations recorded by the source corpus.

Subfields: Industrial and Manufacturing Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/e2814d55de0904fcfb2b4ed972447f8575abdfa4