Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging

By Shuai Wang, Mingyu Li, Hongjun Ji, Chunqing Wang. 2013

168 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/e171a9ec40b4cb47e537d51c482890c17402fa1a