Super-hydrophobic nickel films with micro-nano hierarchical structure prepared by electrodeposition for appliance industry

By T. Hang, Ming Li, Anmin Hu, D. Mao. 2009 International Conference on Electronic Packaging Technology & High Density Packaging, 2009

183 citations recorded by the source corpus.

Subfields: Computational Mechanics, Electrical and Electronic Engineering, Surfaces, Coatings and Films

View Paper: https://www.semanticscholar.org/paper/e072bcbe399cfdc8238b516007aafcabaf8feac2