Physical Vapor Deposition of Thin Films

By J. Mahan. 2000

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Strength and plasticity of nanolaminated materials (2017, background): “For example, in Cu–Nb, the interface habit planes are {111}Cu||{110}Nb for PVD [3,19–21] and {112}Cu||{112}Nb for ARB [15,21], both with the same Kurdjumov–Sachs (KS) orientation relationship [5,22–27].”
Performance Improvement of IPMC (Ionic Polymer Metal Composites) for a Flapping Actuator (2006, methodology): “Since the platinum plate is quite expensive, 100nm thick platinum was sputtered by the PVD process [13,14] on one side of the 25μm thick copper plate, where the surface”
Breakthroughs in NiOx-HTMs towards stable, low-cost and efficient perovskite solar cells (2018, background): “On the other hand, physical processes composed of pulsed laser deposition (PLD) [106], physical vapour deposition (PVD) [107], molecular beam epitaxy [108], and magnetron sputtering [109].”
Synthesis of vanadium dioxide thin films and nanoparticles (2008, background): “The RF sputtering apparatus operates at lower voltage and lower sputtering gas pressures while producing higher deposition rates and, most importantly, sputtering of an electrically insulating target becomes possible (Mahan 2000, Wasa et al 2004).”