Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication

By A. Heryanto, W. N. Putra, A. Trigg, S. Gao, W. Kwon, F. Che, X. Ang, J. Wei, R. I Made, C. Gan and 1 more. Journal of Electronic Materials, 2012

154 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/decfc9060bb031afedd7fa8983b50320ee14ae38