Integrating stereolithography and direct print technologies for 3D structural electronics fabrication

By Amit J. Lopes, Eric MacDonald, Ryan B. Wicker. 2012

421 citations recorded by the source corpus.

Subfields: Automotive Engineering, Electrical and Electronic Engineering, Human-Computer Interaction

View Paper: https://www.semanticscholar.org/paper/dc10048c7852502da872aabf61386e09e3aacffe

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Automotive Engineering

1. Yaoyao Fiona Zhao
2. Sheng Yang
3. Albert C. To
4. Andrew T. Gaynor
5. Lin Cheng
6. Eric MacDonald
7. David Espalin
8. Ryan B. Wicker

In Electrical and Electronic Engineering

1. David Espalin
2. Ryan B. Wicker
3. Lei Li
4. Krishnan Suresh
5. David W. Rosen
6. Zhan Kang

In Human-Computer Interaction

1. Ryan B. Wicker
2. Eric MacDonald
3. J. Gardan

Citations in the corpus

• Advanced robotics and additive manufacturing of composites: towards a new era in Industry 4.0 (2021, background): “Lopes et al.[343] commented on the incorporation of stereolithography, direct print, and other AM technologies to implement multifunctional structural systems.”
• Overview on Additive Manufacturing Technologies (2017, background): “, conductive inks [67]); and 3) embed electronic components within polymer substrates during fabrication [68].”
• Research supporting principles for design for additive manufacturing (2014, background): “Researchers in the W.M. Keck Center for 3D Innovation at the University of Texas at El Paso have demonstrated the ability to produce a number of working devices by novel combinations of stereolithography (SL) and direct-write (DW) (Lopes et al. 2012).”
• Multiprocess 3D printing for increasing component functionality (2016, background): “dispensed conductive inks to manufacture electronics with antennas built directly into solid polymer structures (11).”
• Additive manufacturing-enabled design theory and methodology: a critical review (2015, background): “The first one is the combination of different AM technologies like the combination of stereolithography (SL) and direct write (DW) in the area of electronics [30, 31].”
• The status, challenges, and future of additive manufacturing in engineering (2015, neutral): “olithography [161,162], extrusion [163,164], and polymer powder”
• Multi-material, multi-technology FDM: exploring build process variations (2014, methodology): “Work performed within the AM arena using discrete multi-material fabrication includes the production of functional electroactive polymer actuators via non-heated material extrusion as well as biomedical scaffolds and three-dimensional (3D) structural electronics via vat photopolymerization (Malone a”