Optimum process parameters for ultrasonic consolidation of 3003 aluminium
By C. Kong, R. Soar, P. Dickens. 2004
186 citations recorded by the source corpus.
Subfields: Aerospace Engineering, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/dc05d6f80a281497dd2fc4b77ccdd555846d1a48
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Mechanical Engineering
- M. Doddamani
- Wanasinghe Arachchige Dumith Madushanka Jayathilaka
- A. Chinnappan
- V. Kumar
- Long T. Tran
- Dongxiao Ji
- Seeram Ramakrishna
- T. Tran
Citations in the corpus
- 3D Printing of Highly Pure Copper (2019, methodology): “In this method, an ultrasonic wave and mechanical pressure are applied on metallic tapes at room temperature to bond the interfaces of the stacked tapes by diffusion [99].”