Solid state diffusion in Cu–Sn and Ni–Sn diffusion couples with flip-chip scale dimensions

By R. Labie, W. Ruythooren, J. van Humbeeck. 2007

139 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/db9cae8f6d25b8b7d25ed0eb9cd4960ab0ad993d