Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips

By W. Escher, T. Brunschwiler, Bruno Michel, Dimos Poulikakos. 2010

185 citations recorded by the source corpus.

Subfields: Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/db32dbcd31627a940cba1a35aa6245f6c44452f4

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1. R. van Erp
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5. L. Nela
6. Zhibin Yu

Citations in the corpus

• Co-designing electronics with microfluidics for more sustainable cooling (2020, methodology): “…Ndao et al. 2009 - Multi-Jet General Optimization [38] Everhart et al. 2007 Bare die MMC bare die cooling Power diode Experimental [35] Escher et al. 2010 Embedded MMC Logic Experimental [64] Colgan et al. 2005 Embedded or indirect Offset strip fin Logic Experimental [69] Ditri et al.…”