Semiconductor wafer bonding via liquid capillarity

By Z. Liau. 2000

223 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/da0f87c2c578ddbe8cc220b3625735d9d492c0f9

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Mircea Guina
2. Antti Härkönen
3. A. Rantamäki

Citations in the corpus

• High‐brightness long‐wavelength semiconductor disk lasers (2008, background): “Here, a material of high thermal conductivity is bonded [35] to the surface of the device, close to the active region.”
• Optically pumped VECSELs: review of technology and progress (2017, background): “The transparent heat spreader and the semiconductor sample are commonly mounted using capillary bonding [42] with deionized water or another suitable liquid.”