Advanced Materials for Thermal Management of Electronic Packaging

By X. Tong. 2011

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Diamond power devices: state of the art, modelling, figures of merit and future perspective (2019, background): “For the heatsink volume, natural convection is considered with a volumetric resistance of 500 cm3 K W−1 [191].”
Thermal properties of graphene and multilayer graphene: Applications in thermal interface materials (2012, background): “It was observed that a reduction in the PV cell temperature by 15 1C at one sun illumination boosts 6% in the output power [17,20].”
Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials (2016, methodology): “A needle-probe device can be used to measure sample thermal properties in situ, but most commonly a temperature-controlled furnace is used to produce the base temperatures for the measurements [53].”
Progress in research on hybrid metal matrix composites (2020, unknown): “Tong [202] have introduced the advantages and disadvantages of conventional MMCs containing different reinforcements in his previous book.”
Two-Dimensional Materials for Thermal Management Applications (2018, background): “In accordance with the package structure, TIMs can be categorized into several groups including polymer-based composites, solders, and other materials.(110) Among them, polymer-based composites with epoxy, silicone, poly(methyl methacrylate) (PMMA) and poly(vinyl alcohol) (PVA) matrix are most widel”