Effect of bonding temperature on microstructure development during TLP bonding of a nickel base superalloy

By M. Pouranvari, A. Ekrami, A. Kokabi. 2009

155 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/d590fdca588a43c907199b5ec4335d4ca8edb722