Microstructure to substrate self-assembly using capillary forces

By U. Srinivasan, D. Liepmann, R. Howe. 2001

440 citations recorded by the source corpus.

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Advances and challenges in the development of power-generation systems at small scales (2011, background): “This type of assembly has been shown for micromirrors [113,114], but this type of assembly however, is not feasible for systems that are poisoned by liquid solutions.”
Surface tension-powered self-assembly of microstructures - the state-of-the-art (2003, background): “In the RHS, an alternative local energy minimum has resulted in incorrect alignment [140].”
Electrostatic charge and field sensors based on micromechanical resonators (2003, methodology): “We used the fluidic self-assembly process developed by Srinivasan [ 8 ] to align and bond the JFETs to the SOI structures.”
Controlled multibatch self-assembly of microdevices (2003, methodology): “adopted the capillary force driven assembly technique in [18], [19] to assemble microscopic parts onto desired sites on silicon and quartz substrates [21], [22].”
Micro-Electrostatic Vibration-to-Electricity Converters (2002, methodology): “The bare die diodes are then attached to the solder bumps by a fluidic self-assembly process [10] after which the solder is reflowed to create a good electrical connection.”