Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

By Jianfeng Li, Pearl A. Agyakwa, Christopher Mark Johnson. 2011

380 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/d228e81479fa12774e5484cc74a29c08123cfda5