Electrodeposition of Copper Thin Film on Ruthenium A Potential Diffusion Barrier for Cu Interconnects

By O. Chyan, T. Arunagiri, T. Ponnuswamy. 2003

214 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/d08494d58aa83f856cc9111b15af93f1fd382585