A new two-dimensional ultrasonic assisted grinding (2D-UAG) method and its fundamental performance in monocrystal silicon machining

By Zhiqiang Liang, Yongbo Wu, Xibin Wang, Wenxiang Zhao. 2010

161 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/ce238d2e423a8c228906268e4de3a7dbc3f275b5

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Biomedical Engineering

1. H. S. Payal
2. S. Sidhu
3. P. S. Bains

In Electrical and Electronic Engineering

1. H. S. Payal
2. S. Sidhu
3. P. S. Bains

In Mechanical Engineering

1. H. S. Payal
2. S. Sidhu
3. P. S. Bains

Citations in the corpus

• Fabrication and Machining of Metal Matrix Composites: A Review (2016, result): “[132] concluded the similar results while the ultrasonic-assisted grinding (UAG) of silicon, where an axial vibration gives a better surface roughness.”