Low‐Temperature In Situ Large‐Strain Plasticity of Silicon Nanowires
By X. Han, K. Zheng, Y. F. Zhang, X. N. Zhang, Zhenyu Zhang, Z. L. Wang. Advances in Materials, 2007
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mentally. In this report, we present in situ TEM observation of the elastic-plastic-fracture processes of a single Si NW recorded at atomic resolution. The study directly shows the strain-induced structural evolution process of Si NWs and its largestrain plasticity (LSP). Our results indicate that the LSP of Si NWs via a brittle-ductile transition originates from a dislocation-initiated amorphization. This behavior is in contrast to the mechanical behavior of bulk Si. Our observation reveals a phenomenon and mechanism of the Si NW mechanics and is fundamentally important for Si-NW-based nanotechnology. The in situ Si NW elastic, elastic-plastic, and plastic deformation investigations were carried out by ultrahigh-resolution TEM (UHRTEM) by axially extending the Si NWs by means of a mechanical force created by a TEM specimen-supporting grid under electron beam irradiation, as reported in detail elsewhere [17,18] (also see the Experimental section and Sup
Subfields: Atomic and Molecular Physics, and Optics, Biomedical Engineering, Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/cdfdbdc4709ae2d63d9468dd92ea1154cfa4f35c
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Citations in the corpus
- Thermo-mechanical behavior of low-dimensional systems: The local bond average approach (2009, background): “[388] The counterpart of competition comes from dislocation accumulation and strain gradient work hardening that inhibit further sliding dislocations, which complies with the traditional”
- Ultra-strength materials (2010, background): “tension [172] and silicon nanopillars in compression [355] at room temperature.”
- Size and temperature effects on the fracture mechanisms of silicon nanowires: Molecular dynamics simulations (2010, methodology): “The mechanical properties of semiconducting NWs have been measured both in tensile tests (Kizuka et al., 2005; Han et al., 2007) and in bending tests (Paulo et al., 2005; Heidelberg et al., 2006; Hoffmann et al., 2006).”