High-Aspect-Ratio Copper Via Filling Used for Three-Dimensional Chip Stacking

By J. Sun, K. Kondo, T. Okamura, S. Oh, M. Tomisaka, H. Yonemura, M. Hoshino, Kenji Takahashi. 2003

142 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/cd53dea208c8c0cc38a7fb679c2ef867692fdae6