Interfacial intermetallic growth and shear strength of lead-free composite solder joints

By S. Nai, Jun Wei, Manoj Gupta. 2009

145 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/cd1815b5df7c1d27a49fd4ce867a36427e94ae85