Thermal properties of diamond/copper composite material

By Katsuhito Yoshida, H. Morigami. Microelectronics and reliability, 2004

377 citations recorded by the source corpus.

Subfields: Materials Chemistry, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/cd02aa2b8566e7ef5dafcce8079a5e42ac889486

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1. Jhewn-Kuang Chen
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Citations in the corpus

• Thermal Conductivity of Diamond Composites (2009, neutral): “The thermal conductivity of composites was reported to reach 700 W/(m⋅K) in [12,15,99], and 640 W/(m⋅K), by Schubert et al.”
• Thermal properties of aluminum–graphite composites by powder metallurgy (2013, background): “It is further noted that these values are no lower than diamond/ copper composites reported by Yoshida and Morigami [22] where up to 80 vol.% of diamond is added into copper demonstrating 742 W/m/K thermal conductivity.”