Adhesion and reliability of copper interconnects with Ta and TaN barrier layers

By M. Lane, R. Dauskardt, Nety M. Krishna, I. Hashim. 2000

162 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

View Paper: https://www.semanticscholar.org/paper/cbbf3b676efa7f6b8db753b6fb389c3e5058ac09