Material removal mechanism and grinding force modelling of ultrasonic vibration assisted grinding for SiC ceramics

By Chen Li, Fei-hu Zhang, B. Meng, Lifei Liu, Xiaoshuang Rao. 2017

276 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/ca1d9352cccd6dbfa52683abbab1f0b38a47430b

Citations in the corpus

• Damage evolution mechanism and low-damage grinding technology of silicon carbide ceramics (2024, unknown): “(a ) Schematic diagram and experimental setup of UVAG, Reprinted from [190], © 2016 Elsevier Ltd and Techna Group S.r.l.”