Thermoelectric water-cooling device applied to electronic equipment

By Hsiang-Sheng Huang, Ying-Che Weng, Yu-Wei Chang, Sih-Li Chen, M. Ke. 2010

133 citations recorded by the source corpus.

Subfields: Civil and Structural Engineering, Materials Chemistry, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/c795082398780fa4c157ed1f5462c880a334ee39

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Civil and Structural Engineering

1. Gang Tan
2. Dongliang Zhao
3. Hosung Lee

In Materials Chemistry

1. Dongliang Zhao
2. Gang Tan
3. Hosung Lee

In Mechanical Engineering

1. Hosung Lee
2. Dongliang Zhao

Citations in the corpus

• A review of thermoelectric cooling: Materials, modeling and applications (2014, background): “108 K/W [45]) and heat sink integrated with heat pipe (example thermal resistance of 0.”
• Optimal design of thermoelectric devices with dimensional analysis (2013, methodology): “[29] conducted experiments for a TEC from a heat source with air-cooling and water cooling heat sinks, respectively.”