Grinding characteristics, material removal and damage formation mechanisms in high removal rate grinding of silicon carbide

By S. Agarwal, P. Rao. 2010

139 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Civil and Structural Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/c695a4f405a94b63be94adcd820fb91a6be9069b

Citations in the corpus

• Damage evolution mechanism and low-damage grinding technology of silicon carbide ceramics (2024, unknown): “Agarwal and Rao [84] demonstrated that brittle damages of SiC ceramics induced by grinding mainly consisted of intergranular cracks, grain-boundary micro-fractures and fracture pits caused by grain displacement under a high material removal rate.”