Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples

By Ping-Feng Yang, Y. Lai, S. Jian, Jiunn Chen, Rong-Sheng Chen. 2008

154 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/c6785703cf157d3665690b8d464aaef12f3f4c6e