UV- and thermal-curing behaviors of dual-curable adhesives based on epoxy acrylate oligomers

By Young-jun Park, Dong-Hyuk Lim, Hyun-Joong Kim, D. Park, Ick-Kyung Sung. 2009

217 citations recorded by the source corpus.

Subfields: Mechanical Engineering, Organic Chemistry

View Paper: https://www.semanticscholar.org/paper/c54ff9a0ab213167217d61cc4a18a7c47371f44a