Influence of Bi on microstructures evolution and mechanical properties in Sn–Ag–Cu lead-free solder

By Jie Zhao, Linge Qi, Xiu-min Wang, Lai Wang. 2004

182 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/c4c0849a66fc22e85c93435e0c38b2d2e24ccad1