Bonding characteristics during very high power ultrasonic additive manufacturing of copper

By M. Sriraman, S. Babu, M. Short. 2010

142 citations recorded by the source corpus.

Subfields: Materials Chemistry, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/c4a9faafc69002f3db5d65d802a50765ccab3829

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Materials Chemistry

1. Christopher B. Williams
2. Seeram Ramakrishna
3. Yun Bai

In Mechanical Engineering

1. M. Doddamani
2. Wanasinghe Arachchige Dumith Madushanka Jayathilaka
3. Christopher B. Williams
4. A. Chinnappan
5. V. Kumar
6. Long T. Tran
7. Dongxiao Ji
8. Seeram Ramakrishna

Citations in the corpus

• 3D Printing of Highly Pure Copper (2019, background): “Welding tapes are usually difficult due to m terial hardening and oxidation issues, leading to the requirement of high power used in the process (up to 9 kW) [95,96,100].”
• Anisotropy and heterogeneity of microstructure and mechanical properties in metal additive manufacturing: A critical review (2018, unknown): “VHP UAM 1500x1500x600 9 kW @ 20 kHz 150 [51, 52]”
• An exploration of binder jetting of copper (2015, background): “Tapes of copper were successively stacked and joined via ultrasonic welding, in which the recrystallized fine grains were converted from coarse-grained structures [9–11].”