Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder

By L. Tsao, S. Chang, C. Lee, W. Sun, C. Huang. 2010

202 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/c3693ae7d169155a9f7fe446937329f2fcd0b0c7