Parametric numerical study of the flow and heat transfer in microchannel with dimples

By Ming-hai Xu, Hui Lu, L. Gong, J. Chai, X. Duan. 2016

138 citations recorded by the source corpus.

Subfields: Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/c36745cfefc27b1023813e1a703b2317c4a749d7

How researchers see this paper

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In Mechanical Engineering

1. Motong Li
2. Zhibin Yu
3. Bing-yang Cao

Citations in the corpus

• A comprehensive review on microchannel heat sinks for electronics cooling (2023, methodology): “…of the active method, external energy is supplied to produce an unsteady flow, while the passive method is to enlarge the heat transfer surface [43–51], promote fluid mixing [181– 183] or improve the thermal properties of coolants by optimizing the geometric structures [184] or use various…”