Enhanced thermal conductivity of polymer composites filled with hybrid filler

By G. Lee, Min Park, Junkyung Kim, Jae Ik Lee, H. Yoon. 2006

798 citations recorded by the source corpus.

Subfields: Ceramics and Composites, Materials Chemistry, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/c361a565776db74f9f99db7871bb3f173219a50b

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Ceramics and Composites

1. Toshikatsu Tanaka
2. P. Jiang
3. Girish M. Joshi
4. Xingyi Huang
5. C. Ramesh Kumar
6. M. Vadivelu

In Materials Chemistry

1. P. Jiang
2. Xingyi Huang
3. R. Bhatti
4. Toshikatsu Tanaka
5. Girish M. Joshi
6. Chris Best
7. In‐Yup Jeon
8. C. Ramesh Kumar

In Mechanical Engineering

1. R. Bhatti
2. B. Sun
3. C. Y. Shen
4. B. Lee
5. Chris Best
6. In‐Yup Jeon
7. Sabuj Mallik
8. Jong‐Beom Baek

Citations in the corpus

• Investigation of thermal management materials for automotive electronic control units (2011, background): “Mechanical Integrity Pre-processing Cost Processing Cost Post-processing Cost (Net-shape fabrication, machining) Key Extreme/Bad Medium/ Acceptable Low/Good 1 10 100 0 100 200 300 400 500 Thermal Conductivity (W/mK) C T E ( 1 0 -6 / K ) Figure 3: Thermal conductivity Vs CTE for different metals, met”
• Novel nanostructured thermal interface materials: a review (2018, neutral): “rods with spherical particles [68] in 2006.”
• The effects of particle size and content on the thermal conductivity and mechanical properties of Al 2 O 3 /high density polyethylene (HDPE) composites (2011, background): “minum nitride (AlN) [2, 3], silicon nitride (Si3N4) [8, 9], alumina [10], silicon carbride (SiC) [11] and silica (SiO2) etc.”
• Polymer composites for thermal management: a review (2016, methodology): “[56] Apart from particles, whiskers have also been used to prepare high thermal conductivity composites.[57,58]”