Application of graphene as filler to improve thermal transport property of epoxy resin for thermal interface materials

By Boxin Tang, G. Hu, Hanyang Gao, Liuyu Hai. 2015

171 citations recorded by the source corpus.

Subfields: Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/c3218f2d41364387e02f2c9dd43814217b40719b

How researchers see this paper

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In Materials Chemistry

1. Anthony J. Robinson
2. G. Cross
3. Johan Liu
4. Kafil Mahmood Razeeb
5. J. Hansson
6. Eric E. Dalton

Citations in the corpus

• Present and future thermal interface materials for electronic devices (2018, background): “that functionalisation reduces the Kapitza resistance between the filler material and the matrix [120].”
• Novel nanostructured thermal interface materials: a review (2018, background): “9 1900 [49] Ceramic Fillers BN Epoxy 20 wt-% 0.”