Direct Ink Writing of 3D Functional Materials
By J. A. Lewis. 2006
1,530 citations recorded by the source corpus.
Subfields: Atomic and Molecular Physics, and Optics, Electrical and Electronic Engineering, Surfaces, Coatings and Films
View Paper: https://www.semanticscholar.org/paper/c13f0faab644a1b9a3d1c9a9db33d11617eb5b72
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In Atomic and Molecular Physics, and Optics
In Electrical and Electronic Engineering
In Surfaces, Coatings and Films
Citations in the corpus
- The Emerging Frontiers and Applications of High-Resolution 3D Printing (2017, neutral): “EHDP 30 nm PLA, PCL, PEO, particles MEMS, biosensor, tissue engineering, flexible electronics [21,46,51] DIW 1 μm Hydrogel, silicone elastomer, metal, wax Flexible electronics, biosensor, energy storage, biomedicine [30,33,35,38,83,113]”
- Soft Robots Manufacturing: A Review (2018, methodology): “Finally, halfway between FDM and inkjets, direct ink writing (Lewis, 2006) is a method that uses solidifying viscous inks to create complex shapes.”