Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding

By S. Agarwal, P. Rao. 2008

359 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Civil and Structural Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/bfb0b880da86d829b09d3f33aeeef887d711d573

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Biomedical Engineering

1. Renjie Ji
2. Yonghong Liu
3. Fei Wang
4. Yanzhen Zhang

In Civil and Structural Engineering

1. Renjie Ji
2. Yonghong Liu
3. Fei Wang
4. Yanzhen Zhang

In Mechanical Engineering

1. Renjie Ji
2. Yonghong Liu
3. Fei Wang
4. Yanzhen Zhang

Citations in the corpus

• Machining performance of silicon carbide ceramic in end electric discharge milling (2011, methodology): “However, due to its brittleness and high hardness, the traditional methods of machining SiC ceramic using diamond grinding or lapping are very slow and expensive, and can also cause strength degradation due to the formation of surface and subsurface cracks or other defects [11–13].”