Atomic Layer Deposition of Ultrathin Copper Metal Films from a Liquid Copper(I) Amidinate Precursor
By Zhengwen Li, A. Rahtu, R. Gordon. 2006
203 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials
View Paper: https://www.semanticscholar.org/paper/bee53445ff7b0b4eaed94aa771ce4890434b790e
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In Electrical and Electronic Engineering
In Electronic, Optical and Magnetic Materials
Citations in the corpus
- Metal-based Inkjet Inks for Printed Electronics (2011, background): “9 μ cm for 80 nm thick film, that is 20% higher compared to Cu films obtained by PVD [161].”