A state-of-the-art survey of Digital Twin: techniques, engineering product lifecycle management and business innovation perspectives

By Kendrik Yan Hong Lim, Pai Zheng, Chun-Hsien Chen. Journal of Intelligent Manufacturing, 2019

561 citations recorded by the source corpus.

Subfields: Industrial and Manufacturing Engineering, Safety, Risk, Reliability and Quality

View Paper: https://www.semanticscholar.org/paper/bdafbe81b71b836115f5197b7c6ca4fc6aa4ca30