Characterization and modeling of oxide chemical-mechanical polishing using planarization length and pattern density concepts

By D. Ouma, Duane S. Boning, J. Chung, W. G. Easter, V. Saxena, S. Misra, Annette Crevasse. 2002

144 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electronic, Optical and Magnetic Materials, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/bcda0d6dc52011f6f3c625826a76bc9b157035af