Sub-10 nm fabrication: methods and applications

By Yiqin Chen, Zhiwen Shu, Shi Zhang, Pei Zeng, Huikang Liang, Mengjie Zheng, H. Duan. International Journal of Extreme Manufacturing, 2021

181 citations recorded by the source corpus.

Reliable fabrication of micro/nanostructures with sub-10 nm features is of great significance for advancing nanoscience and nanotechnology. While the capability of current complementary metal-oxide semiconductor (CMOS) chip manufacturing can produce structures on the sub-10 nm scale, many emerging applications, such as nano-optics, biosensing, and quantum devices, also require ultrasmall features down to single digital nanometers. In these emerging applications, CMOS-based manufacturing methods are currently not feasible or appropriate due to the considerations of usage cost, material compatibility, and exotic features. Therefore, several specific methods have been developed in the past decades for different applications. In this review, we attempt to give a systematic summary on sub-10 nm fabrication methods and their related applications. In the first and second parts, we give a brief introduction of the background of this research topic and explain why sub-10 nm fabrication is interesting from both scientific and technological perspectives. In the third part, we comprehensively summarize the fabrication methods and classify them into three main approaches, including lithographic, mechanics-enabled, and post-trimming processes. The fourth part discusses the applications of these processes in quantum devices, nano-optics, and high-performance sensing. Finally, a perspective is given to discuss the challenges and opportunities associated with this research topic.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/bc6c17f02b1ac241c521e17b7eb3e9c57b495145

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

1. Jinlong Zhu
2. Jiamin Liu
3. Shiyuan Liu
4. Zexu Zhang
5. Tianlai Xu
6. Shuai Yuan
7. R. Zhou
8. Hao Jiang

Citations in the corpus

• Optical wafer defect inspection at the 10 nm technology node and beyond (2022, methodology): “As sub-10 nm manufacturing is entering the mainstream [186, 187], advanced lithography techniques such as multiple patterning and EUV lithography will be used in the fab.”