ELECTROCOAGULATION OF CHEMICAL MECHANICAL POLISHING (CMP) WASTEWATER FROM SEMICONDUCTOR FABRICATION

By C. Lai, Sheng H. Lin. 2003

187 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/b9d08e1c2dc9378d7c341709236d642a96a7f988

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Biomedical Engineering

1. Yan Liu
2. V. Khandegar
3. Man Chen
4. J. Nouri
5. A. Saroha
6. Hiwa Hossaini
7. Mohammad Malakootian
8. Y. Hao

In Electrical and Electronic Engineering

1. Yan Liu
2. V. Khandegar
3. Man Chen
4. J. Nouri
5. A. Saroha
6. Hiwa Hossaini
7. Mohammad Malakootian
8. Y. Hao

In Materials Chemistry

1. Yan Liu
2. V. Khandegar
3. Man Chen
4. J. Nouri
5. A. Saroha
6. Hiwa Hossaini
7. Mohammad Malakootian
8. Y. Hao

Citations in the corpus

• Electrocoagulation for the treatment of textile industry effluent--a review. (2013, methodology): “6 FeeFe 84 Adhoum and Monser (2004) Olive mill 75 mA/cm 25 4e6 AleAl 76 Lai and Lin (2004) Chemical mechanical polishing e 30 7.”
• Study on the adsorption of Cu(II) by EDTA functionalized Fe3O4 magnetic nano-particles (2013, methodology): “Up to now, numerous technologies have been developed for the removal of Cu(II) from wastewater such as chemical precipitation [5], ion exchange [6], liquid–liquid extraction [7], membrane filtration [8], biosorption [9], electrodialysis [10], and electro-coagulation [11].”
• Removal of heavy metals from paint industry’s wastewater using Leca as an available adsorbent (2009, methodology): “The most widely used methods to remove heavy metals are chemical or electrochemical precipitation (Lai and Sheng, 2003; Mahvi, 2008).”