Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications

By I. Anderson. 2006

233 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/b95c59f1c458f9b0ea698e5b5642a462c3810b8f