Tight and Compact MILP Formulation for the Thermal Unit Commitment Problem

By Germán Morales-España, Jesús M. Latorre, Andrés Ramos. IEEE Transactions on Power Systems, 2013

418 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality

View Paper: https://www.semanticscholar.org/paper/b8d3f9efd91eab29f237c5f4e95abb75437b06b4

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In Electrical and Electronic Engineering

  1. Pedro Sanchez-Martin
  2. Carlos M. Correa-Posada
  3. Guglielmo Lulli
  4. Bo Zeng
  5. Efraim Centeno
  6. Suvrajeet Sen
  7. Yao Zhang
  8. S. Wogrin

In Safety, Risk, Reliability and Quality

  1. Guglielmo Lulli
  2. Bo Zeng
  3. Suvrajeet Sen
  4. Yao Zhang
  5. Zechun Hu
  6. Jianxue Wang
  7. Semih Atakan

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