Elastic properties, hardness, and indentation fracture toughness of intermetallics relevant to electronic packaging

By G. Ghosh. 2004

204 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/b7aafc4a063e2ad3c971a87a9cce2687786d8cac